Enhanced thermal management in 3D integrated circuits coupling

Abstract

3D IC integration, which comprises vertically stacking several IC layers, is one of the new technologies that works well with complementary metal-oxide-semiconductor (CMOS) implementations. The layers of a three-dimensional integrated circuit (3D IC) are physically and electrically connected via copper-silicon bonding and through silicon vias (TSVs). Limitations in 3D IC designs, such as layer-to-layer thermal difficulties and TSV-to-substrate and TSV-to-TSV noise coupling, significantly impact system performance as a whole. Integrating 3D ICs relies heavily on heat spreaders and thermal through silicon vias (TTSVs). Overheating is a common cause of IC failure; however, heat spreaders and FIN to TTSV have been suggested as potential remedies for this problem in the last few years. A 3D IC might melt under the stress of an applied voltage because it becomes hotter inside. Engineers have added fins to the TTSV in a number of ways, each of which maximizes heat dissipation in a different way, in order to reduce this danger. The exceptional thermal cooling characteristics of graphene and carbon nanotubes (CNTs) have led to their widespread dissemination. This research shows that a FIN may efficiently transport thermal energy to a heat sink by using heat spreaders and optimum orientations to distribute heat in all directions. Additionally, we demonstrated the many scenarios in which the IC's potential distribution is impacted by various thermal cooling effects. We found that when it comes to transferring heat away from heat sources and TSVs, CNTs outperform Graphene. We included Al2o3, Si3N4, and SiO2 as examples to examine the consequences of modifying the model's dielectric characteristics.